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1. Supports the Intel Xeon E processor. A single CPU supports up to 8 cores and 16 threads with a TDP up to 95W. 2. Supports up to 4 DIMMs slots and two 2.5-inch drives.
1. The modular design improves O&M flexibility. 2. Front I/O design and isolated cold and hot air passages improve the cooling efficiency of the server room.
1. Supports up to 2 PCIe 3.0 x8 slots. 2. Supports up to 2 HHHL PCIe devices.
1. Depth is only 420 mm (16.54 in.), saving deployment space and supports both rack-mounted and wall-mounted deployment. 2. Adaptability to operating temperature ranging between 5°C and 35°C (41°F and 95°F) and an operating humidity ranging between 10% and 90%.
Item | Description |
Form Factor | 1U rack server |
Processor | Supports 1 Intel Xeon E processor Up to 8 cores (base frequency of up to 3.4 GHz) TDP at up to 95 W |
Memory | Up to 3 available DIMM slots DIMM type: DDR4 2,666 MHz UDIMM ECC Up to 32 GB per DIMM |
Storage Drive | Up to 2 × 2.5-inch hot-swap SAS/SATA drive 1 × internal M.2 SSD |
Network | 2 × onboard 1 GbE electrical network ports (RJ45) (1 Gbps) |
I/O Expansion | Supports up to 2 PCIe 3.0 x8 slots and HHHL PCIe devices |
Port | 4 × USB 3.0 port 2 × display port and 1 × VGA port 1 × serial port |
Fan | 5 hot-swap fans with N+1 redundancy |
Power Supply | Up to two 550 W CRPS、 80 Plus Platinum PSUs with, 1+1 redundancy, with optional support 220 AC/240 DC input |
Environmental Adaptability | Operating temperature: 5°C to 35°C (41°F to 95°F) Storage and transportation temperature: -40°C to 70°C (-40°F to 158°F) Operating humidity: 10% to 93% RH Storage and transportation humidity: 10% to 93% RH |
Dimensions (W × H × D) | With mounting ears: 481.6 × 43.4 × 420 mm (18.96 × 1.71 × 16.54 in.) With packaging: 729 × 248 × 654 mm (28.70 × 9.76 × 25.75 in.) |
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